What are the opening hours?

Monday 09:00 - 18:00 Tuesday 09:00 - 18:00 Wednesday 09:00 - 18:00 Thursday 09:00 - 18:00 Friday 09:00 - 18:00

SparkLAN Communications, Inc., Taipei (2026)

Name: SparkLAN Communications, Inc.
Address: Taipei, TW
Telephone: 886-2-2659-1880
Price range: ££

08/07/2026

Low-Power Connectivity for Smarter AIoT

As AIoT applications continue to expand, developers need wireless solutions that combine low-power operation, reliable connectivity, strong RF performance, and advanced security—all in a compact design.

SparkLAN SLI-AX55 Wi-Fi 6E & Bluetooth® LE 5.4 SoC module is built to meet these demands. Powered by a 192 MHz Cortex®-M33 with integrated 8 MB PSRAM and 8 MB NOR Flash, it supports tri-band Wi-Fi 6E (2.4/5/6 GHz) and delivers higher TX power and superior RX sensitivity for stable, high-performance wireless communication. Arm® TrustZone® security further enhances device protection for today's connected products.

Designed for Smart Home, Industrial Automation, Medical Devices, Enterprise IoT, Smart Lockers, and other AIoT applications, SLI-AX55 provides a compact, secure, and low-power wireless platform to help accelerate the development of next-generation connected devices.

SLI-AX55 | Wi-Fi 6E 2.4/5/6 GHz and and Bluetooth LE 5.4 SoC Module | https://www.sparklan.com/product/sli-ax55

Learn More : https://www.sparklan.com/low-power-wi-fi-6e-bluetooth-le-5-4-soc-module-for-aiot-applications/

02/06/2026

Day 1 at COMPUTEX 2026.

We’re excited to kick off another week of conversations, connections, and opportunities.

Looking forward to meeting customers, partners, and industry friends from around the world over the coming days.

📍 Hall 1, Booth K0323a

15/04/2026

SparkLAN & AMPAK at COMPUTEX 2026 | Edge AI Connectivity

SparkLAN and AMPAK will co-exhibit at COMPUTEX 2026, presenting next generation Edge AI and advanced wireless connectivity solutions for AIoT and smart infrastructure environments.

This year's showcase features AI Box PC, 5G RedCap, SoM, SiP, and Wi-Fi 7 modules - integrating edge computing with reliable, low latency connectivity to support scalable deployments, including 5G RedCap enabled drone applications.

Visit our booth to explore how SparkLAN and AMPAK are advancing intelligent connectivity, and connect with our team to discuss real world applications and potential collaborations.

📍 Taipei Nangang Exhibition Center, Hall 1, 1F
Advanced Communication & Networking Zone
Booth No. K0323a

We look forward to seeing you at COMPUTEX 2026.

Learn More: https://www.sparklan.com/computex-taipei-2026-invitation-sparklan-x-ampak/

26/03/2026

As demand for compact and highly integrated devices continues to grow, delivering stable wireless connectivity within limited space has become a key design challenge.

The AP5811SA Wi-Fi 6/6E SiP module is designed to support portable and wearable devices with low power consumption and reliable RF performance, helping simplify system integration.

With its ultra-compact 7.9 × 7.3 x 1.1mm design, integrated Internal XTAL, and silver-plated RF shielding, the AP5811SA ensures stable wireless performance even in complex environments.

It is well suited for a wide range of applications, including:
• Smart control panels and interactive displays
• POS systems and self-service kiosks
• Wearable, medical, and AR / VR devices

With multi-country certifications including FCC, CE, IC, and MIC, the AP5811SA is ready for global deployment and supports faster time-to-market.

🔗 Learn More : https://www.sparklan.com/ultra-compact-wi-fi-6-6e-sip-module-for-wearable-and-portable-devices/

🔗 AP5811SA | 802.11ax/ac/a/b/g/n Tri-band WiFi SiP Module (WiFi 6/6E), 1T1R | https://www.sparklan.com/product/ap5811sa/

28/01/2026

AI is no longer something you demo. It's something you deploy.
Across manufacturing, healthcare, transportation, and security, Edge AI is moving from concept to daily operation. The real challenge today isn’t just AI performance. It's how easily AI can be deployed, adapted, and integrated into real systems.

SparkLAN is expanding its AI product portfolio with AI BOX and AI Carrier Board solutions, built on the NVIDIA Jetson AGX Orin platform. From ready-to-deploy AI BOX systems to flexible Carrier Board designs, these platforms support different stages of AI deployment, from fast rollout to deeper system customization.

They are especially suited for real-world applications such as Autonomous Mobile Robots (AMR), where AI must operate continuously and respond to dynamic environments.

🔗 Learn More: https://www.sparklan.com/connectivity-for-the-next-generation-of-ai-systems/

👉 IPCN-303 AI BOX | IPCN-303 AI BOX for NVIDIA® Jetson AGX Orin (32GB / 64GB) | https://www.sparklan.com/product/ipcn-303-ai-box/
👉 IPCN-303 Carrier Board | IPCN-303 Carrier Board Applies to NVIDIA® Jetson AGX Orin | https://www.sparklan.com/product/ipcn-303-carrier-board/

Address

Taipei

Opening Hours

Monday	09:00 - 18:00
Tuesday	09:00 - 18:00
Wednesday	09:00 - 18:00
Thursday	09:00 - 18:00
Friday	09:00 - 18:00

Telephone

886-2-2659-1880

Website

http://www.sparklan.com/

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