10/09/2026
China’s CXMT is struggling to achieve acceptable yields for its HBM3 memory chips. Its 8-layer HBM3 production reportedly has yields of just 25% to 30%, with nearly 80 out of every 100 chips failing final quality checks.
The company is reportedly facing difficulties with TSVs, DRAM stacking, and bonding as it attempts to scale HBM production.